SMT (Surface Mount Technology)

These solder stencil printers help precisely place solder paste where you want it on your printed circuit board without a mess or hassle.

• PCB Dimensions:L 50 × W 50 to L 510 × W 510
• PCB Exchange Time:14 sec including transfer
• Printing Accuracy:2Cp ±15.0 μm 6σ (±3σ)

Solder Paste Inspection, abbreviated as SPI, is a specialized process that evaluates/inspects solder paste deposit quality on PCBs.
It ensures the correct deposition of solder paste on the board without faults.

• Maximum PCB Size (L x W):510mmx510mm
• Maximum PCB Inspectable Area (L x W):
• PCB Transport Height:875mm-965mm

Panasonic CM602-L high-speed module placement machine, CM602-L placement machine not only follows the original module of Panasonic CM402, but also adds 12 nozzle high-speed head and direct suction tray as needed.

• Placement Speed:100,000 cph (0.036 s/chip)
• PCB Dimensions:750 x 550 mm

The multifunctional NPM-W2 is equipped with a 12-nozzle head and can place 38,500 components.
120 feeders can be mounted.

• Placement Speed:38,500cph (0.094 s/ chip)
• PCB Dimensions:750 x 550 mm

Automated optical inspection (AOI) is an automated visual inspection of printed circuit board (PCB) (or LCD, transistor) manufacture where a camera autonomously scans the device under test for both catastrophic failure (e.g. missing component) and quality defects (e.g. fillet size or shape or component skew).
It is commonly used in the manufacturing process because it is a non-contact test method
The V510i Optimus 3D AOI system is a next generation solution for the SMT line, offering the powerful 3D inspection capabilities.

• Maximum PCB Size (L x W):490mmx510mm (19.2"x20")

A reflow oven is a machine used primarily for reflow soldering of surface mount electronic components to printed circuit boards (PCBs).
In commercial high-volume use, reflow ovens take the form of a long tunnel containing a conveyor belt along which PCBs travel.
For prototyping or hobbyist use PCBs can be placed in a small oven with a door.

Modular system concept

• Efficient heat transfer
• Stable process for lead-free applications
• Minimal downtime
• Integrated residue management
• User-friendly software tools for process monitoring

In the VisionX-Series the soldering process is performed on the basis of convection – that is, the transfer of heat via a flow of gases. Our systems are available in air or nitrogen versions. As an inert, protective gas, nitrogen is the ideal heat transfer medium and prevents disturbing oxidation during the soldering process. The modular system configuration of the VisionXS also offers a high level of flexibility for your production facility.