OTHERS

The Technology of Ersa Rework Systems sustainably secures the added value of electronics:

• Gentle heating technology
• Sensor guided soldering processes
• Contactless residual solder removal
• Precise component placement
• Complete process documentation
• Clear user guidance
• Highly efficient 800 W hybrid heating head
• Homogeneous, large-area IR underheating with three heating zones of 800 W each
• Automatic and precise part alignment by means of image processing
• Highly accurate motorized axis system for part placement (+/- 0.025 mm)
• Guarantees user-independent reproducible repair results
• Process control and documentation via HRSoft operating software

Automatic Goldfinger labeling platform precisely and efficiently paste the Polyimide on the board.

20 million-pixel CMOS lens with high resolution and dual telecentric lenses.
One-key quick measurement placed at will.
Humanized interface intuitive operation.
Reverse extraction of external contour.
Data function with anti-duplication engraving.

Connecting MES system.
Humanized interface intuitive operation.
Fast laser engraving speed, high efficiency, saving manpower, time and consumables for attaching labels, greatly improving production efficiency.

180 kV / 20 W high-power micro-focus tube, can detect details up to a maximum of 0.5μm.
High dynamic temperature-stable GE DXR digital detector at 30 fps (frames per second).
Advanced planarCT option for slicing or multilayer packaging evaluation without excessive structure.

Offline Programming.

• Minimum Panel Size:127mm x 127mm
• Maximum Panel Size:1320.8mm x 1320.8mm
• econstruction Method for CT Technologies - Algebraic Reconstruction Technique (ART)
• Backdrill Inspection

A fast, non-destructive method of material measurement.
It is a method of element qualitative and quantitative analysis that uses high-energy X-rays to excite fluorescence (also known as secondary X-rays, characteristic X-rays) from the surface material of the sample and uses this fluorescence as a method of element qualitative and quantitative analysis.

• Nitrogen outlet purity:99~99.999%
• Nitrogen outlet flow:16.6~114 Nm3/h
• Nitrogen outlet pressure:0.5~0.7 Mpa
• Equipment modularization.
• Online purity monitoring.
• Online flow monitoring.
• Full-color human-machine touch screen.
• Operation history Recording.
• Patented energy saving.
• Remote monitoring.
• Intelligent detection of abnormal.

Based on the JIS Z3284 standard, the viscosity, Ti value, and R of solder paste can be tested with high accuracy.

Intelligent AI algorithms
Count down to 01005 in less than two seconds per reel.
Patented internal optical barcode scanner and connecting other system.