OTHERS簡介
設備清單
- ICT 測試機台
- 全自動裁板機
- 真空包裝機
- 氮氣產生機
- 鋼板清洗機
- 高頻測試房
- 氮氣防潮箱
- 超音波熔接器
- BGA 拆拔機
- 扭力計
- 氮氣產生機
- 測溫計
- X'ray
- X'ray 物質分析儀
- Lite point
- CMU200
- 無塵室
- 鋼板張力計
其他設備說明

Ersa BGA reworkstation
Panasonic_SPG2
The Technology of Ersa Rework Systems sustainably secures the added value of electronics:
- Gentle heating technology
- Sensor guided soldering processes
- Contactless residual solder removal
- Precise component placement
- Complete process documentation
- Clear user guidance
- Highly efficient 800 W hybrid heating head
- Homogeneous, large-area IR underheating with three heating zones of 800 W each
- Automatic and precise part alignment by means of image processing
- Highly accurate motorized axis system for part placement (+/- 0.025 mm)
- Guarantees user-independent reproducible repair results
- Process control and documentation via HRSoft operating software
Goldfinger labeling platform
Automatic Goldfinger labeling platform precisely and efficiently paste the Polyimide on the board.


Keyence_series_im-8000
20 million-pixel CMOS lens with high resolution and dual telecentric lenses.
One-key quick measurement placed at will.
Humanized interface intuitive operation.
Reverse extraction of external contour.
Data function with anti-duplication engraving.
Laser machine
Connecting MES system.
Humanized interface intuitive operation.
Fast laser engraving speed, high efficiency, saving manpower, time and consumables for attaching labels, greatly improving production efficiency.


Phoenix-Xray
180 kV / 20 W high-power micro-focus tube, can detect details up to a maximum of 0.5μm.
High dynamic temperature-stable GE DXR digital detector at 30 fps (frames per second).
Advanced planarCT option for slicing or multilayer packaging evaluation without excessive structure.
Vitrox_3D_AXI_v810i
Offline Programming.
- Minimum Panel Size:127mm x 127mm
- Maximum Panel Size:1320.8mm x 1320.8mm
- econstruction Method for CT Technologies - Algebraic Reconstruction Technique (ART)
- Backdrill Inspection


Xray 物質分析儀
A fast, non-destructive method of material measurement.
It is a method of element qualitative and quantitative analysis that uses high-energy X-rays to excite fluorescence (also known as secondary X-rays, characteristic X-rays) from the surface material of the sample and uses this fluorescence as a method of element qualitative and quantitative analysis.
東宇-氮氣產生機
Nitrogen Machine
- Nitrogen outlet purity:99~99.999%
- Nitrogen outlet flow:16.6~114 Nm3/h
- Nitrogen outlet pressure:0.5~0.7 Mpa
- Equipment modularization.
- Online purity monitoring.
- Online flow monitoring.
- Full-color human-machine touch screen.
- Operation history Recording.
- Patented energy saving.
- Remote monitoring.
- Intelligent detection of abnormal.


錫膏黏度計
MALCOM (PCU-203)
Based on the JIS Z3284 standard, the viscosity, Ti value, and R of solder paste can be tested with high accuracy.
點料機_Xray
X-Ray Component Counter
Intelligent AI algorithms
Count down to 01005 in less than two seconds per reel.
Patented internal optical barcode scanner and connecting other system.
